New logic transistor designs, 3D NAND stacking, and DRAM integration introduce more CMP layers and tighter process windows. Traditional metrology approaches struggle to keep pace, especially with the need for high sampling rates, multiple control zones, and improved signal-to-noise ratios. Onto Innovation’s Intelligent Line Monitoring & Control with Integrated Metrology offers a new approach to CMP process control. By leveraging data feedforward from standalone metrology tools to integrated metrology systems, this solution enables real-time, AI-driven process optimization.

Read more here.

The post

New logic transistor designs, 3D NAND stacking, and DRAM integration introduce more CMP layers and tighter process windows. Traditional metrology approaches struggle to keep pace, especially with the need for high sampling rates, multiple control zones, and improved signal-to-noise ratios. Onto Innovation’s Intelligent Line Monitoring & Control with Integrated Metrology offers a new approach to CMP process control. By leveraging data feedforward from standalone metrology tools to integrated metrology systems, this solution enables real-time, AI-driven process optimization.

Read more here.

The post Enhancing CMP Process Control with Intelligent Line Monitoring & Integrated Metrology appeared first on Semiconductor Engineering.