The ongoing shortage of DRAM memory is also having an increasing impact on the end customer market. Prices for DDR5 modules have been at an elevated level for months. Manufacturers are benefiting from the tight supply situation, while buyers are faced with significantly higher costs. At the same time, reports of supply bottlenecks, speculative withholding of goods and an overall lack of planning certainty are increasing. In this environment, unusual solutions are emerging that were previously only conceivable in specialized circles.

Some technically adept users are now starting to manufacture DDR5 RAM themselves. This is based on bare PCBs with a DDR5-compliant layout, which are purchased via Asian trading platforms. These so-called bare PCBs are then fitted with separately purchased memory chips. Reports of such projects are circulating in hardware forums and technology channels, including GamersNexus.

Source: Samsung

The approach is based on industrial production processes, but is implemented on a small scale. The aim is to become independent of strongly fluctuating module prices and instead rely on individual components whose price development is currently considered to be less volatile. So far, this has not led to widespread availability or even mass application.

Cost analysis and economic classification

According to publicly discussed calculations, the pure material costs for a 16 GB DDR5 module manufactured in-house amount to the equivalent of around 130 euros. This includes memory chips and PCB, but not tools, auxiliary materials or possible rejects. Comparable DDR5 UDIMM modules with 5,600 megahertz are currently available in regular shops from around 165 euros. The mathematical savings are therefore small. This does not take into account working time, technical know-how and the risk of failure. Even a single soldering error can result in the module not initializing or operating unstably under load. From an economic point of view, this is therefore not currently a viable alternative for regular buyers, but an experimental approach with limited savings potential.

Technical requirements and risks

DDR5 memory chips are soldered using the BGA process, in which the contact points are located under the component. This requires precise temperature control, suitable reflow technology and experience in dealing with fine conductor structures. In addition, the SPD memory must be programmed correctly so that mainboards recognize clock frequencies, timings and voltages correctly. Errors in this step mean that the module cannot be used or can only be used to a limited extent.

Building RAM yourself is therefore technically close to professional manufacturing processes without being able to completely replace their quality controls and test procedures. This procedure is not realistically feasible for the average user.

Conclusion

Self-soldered DDR5 RAM can currently be seen primarily as the reaction of a small, technically highly specialized user group to the tense market situation. Economically relevant advantages cannot currently be clearly demonstrated. The high technical complexity, the risk of failure and the low cost savings speak against a broader application. However, if the storage crisis worsens and module prices rise significantly, interest in such approaches could increase. A shift to the mass market is not foreseeable under the current conditions.