Chip Industry Technical Paper Roundup: Dec 22

New technical papers recently added to Semiconductor Engineering’s library:

Name of Paper

Research Organizations

NVIDIA, UW-Madison

A Vertically Integrated Framework for Templati...

New technical papers recently added to Semiconductor Engineering’s library:

Name of Paper	Research Organizations
Kitsune: Enabling Dataflow Execution on GPUs with Spatial Pipelines	NVIDIA, UW-Madison
A Vertically Integrated Framework for Templatized Chip Design	USC
Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review	Arizona State University and Fraunhofer
A Tensor Compiler for Processing-In-Memory Architectures	Univ. of Toronto, Barcelona Supercomputing Center, ETH Zurich, and Max Planck
Advantage in distributed quantum computing with slow interconnects	IonQ Inc. and Aalto University
Breaking ECDSA with Electromagnetic Side-Channel Attacks: Challenges and Practicality on Modern Smartphones	Fraunhofer AISEC, BSI, TUM
Fast prototyping of memristors for ReRAMs and neuromorphic computing	U. of Pisa, U. of Pavia et al.
A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations	Sungkyunkwan Univ., Korea Institute of Industrial Technology, Korea Univ., Seoul National Univ., and Pukyong National Univ.

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