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GaN
⚗️ GaN
Specific
gallium nitride, wide bandgap, power conversion, RF power
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WIN’s 0.12µm
GaN
power
process qualified for 40V operation
⚡
Power Electronics
semiconductor-today.com
·
5d
5 days ago
Actions for WIN’s 0.12µm GaN power process qualified for 40V operation
Less-relevant results
XENSIV™ TMR-based Sensors: Unlocking New Possibilities in Magnetic Sensing
⚡
Power Electronics
Content type:
News
eetimes.com
·
5d
5 days ago
Actions for XENSIV™ TMR-based Sensors: Unlocking New Possibilities in Magnetic Sensing
Northrop Grumman develops market-ready
GaN
chip for
W-band
RF
in under six months
⚡
Power Electronics
semiconductor-today.com
·
3d
3 days ago
Actions for Northrop Grumman develops market-ready GaN chip for W-band RF in under six months
IEEE Celebrates Technology’s Brightest Minds at Annual Event
⚡
Power Electronics
Content type:
News
spectrum.ieee.org
·
5d
5 days ago
Actions for IEEE Celebrates Technology’s Brightest Minds at Annual Event
CGD’s new 650V ICeGaN device for automotive applications helps increase EV range
⚡
Power Electronics
semiconductor-today.com
·
6d
6 days ago
Actions for CGD’s new 650V ICeGaN device for automotive applications helps increase EV range
Asia Daily: June 9, 2026
⚡
Power Electronics
Content type:
News
theasiacable.com
·
5d
5 days ago
Actions for Asia Daily: June 9, 2026
onsemi launches GaNEXUS
gallium
nitride
power
portfolio
⚡
Power Electronics
semiconductor-today.com
·
4d
4 days ago
Actions for onsemi launches GaNEXUS gallium nitride power portfolio
Reply to: Two-dimensional β-TeO 2 as an intrinsic insulator despite conflicting transport signatures
🔆
Photonics
Content type:
Academic
nature.com
·
5d
5 days ago
Actions for Reply to: Two-dimensional β-TeO 2 as an intrinsic insulator despite conflicting transport signatures
EPC2378 25V, 410µΩ eGaN enters mass production for high-density DC–DC
conversion
⚡
Power Electronics
semiconductor-today.com
·
3d
3 days ago
Actions for EPC2378 25V, 410µΩ eGaN enters mass production for high-density DC–DC conversion
Navitas introduces isolated through-hole package for 1200–3300V SiC MOSFETs
⚡
Power Electronics
semiconductor-today.com
·
5d
5 days ago
Actions for Navitas introduces isolated through-hole package for 1200–3300V SiC MOSFETs
QPT unveils AI-driven design service for optimizing thermal interface layer
⚡
Power Electronics
semiconductor-today.com
·
6d
6 days ago
Actions for QPT unveils AI-driven design service for optimizing thermal interface layer
Nexperia and Semikron Danfoss to explore strategic collaboration on SiC
power
modules for automotive applications
⚡
Power Electronics
semiconductor-today.com
·
5d
5 days ago
Actions for Nexperia and Semikron Danfoss to explore strategic collaboration on SiC power modules for automotive applications
Qorvo showcasing
RF
solutions with live demos and technical participation at IMS
⚡
Power Electronics
semiconductor-today.com
·
6d
6 days ago
Actions for Qorvo showcasing RF solutions with live demos and technical participation at IMS
Nexperia brings QDPAK packaging to 1200 V SiC MOSFETs to overcome thermal bottlenecks in
high-power
designs
⚡
Power Electronics
semiconductor-today.com
·
4d
4 days ago
Actions for Nexperia brings QDPAK packaging to 1200 V SiC MOSFETs to overcome thermal bottlenecks in high-power designs
onsemi’s role in NVIDIA MGX ecosystem expanding into 800VDC
power
architectures
⚡
Power Electronics
semiconductor-today.com
·
6d
6 days ago
Actions for onsemi’s role in NVIDIA MGX ecosystem expanding into 800VDC power architectures
Veeco’s new LUMINA+ MOCVD system qualified by Ennostar
🔌
Co-packaged Optics
semiconductor-today.com
·
3d
3 days ago
Actions for Veeco’s new LUMINA+ MOCVD system qualified by Ennostar
Imec adds high-density MIMCAPs, passive modeling and laser-assisted bonding to 300mm
RF
silicon interposer platform
🧩
Semiconductor Packaging
semiconductor-today.com
·
3d
3 days ago
Actions for Imec adds high-density MIMCAPs, passive modeling and laser-assisted bonding to 300mm RF silicon interposer platform
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