AI Isn’t the Real Bottleneck in Autonomy; Wireless Is

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June 2026

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SiMa Launches Agentic Development Environment for Physical AI

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AMD Snaps MEXT to Break the Memory Wall

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YMIN SLX Hybrid Supercapacitors Replace Batteries in Space-Constrained Designs

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RISC-V Silicon in the Jungle Could Save the Amazon

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GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up

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Tensordyne Tapes Out LNS-Based AI Chip, Claims Huge Power Advantages

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Andy McLean: Rapidus MoU Will Help British Innovators Access 2-nm Technology

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How Multi-Sense Technologies Are Redefining Human-Machine Interfaces and Dexterous Robotics

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Imec Pushes Quantum Toward Manufacturable Silicon Systems- EE Times

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UCLA’s $125M Semiconductor Hub: “We Want High Impact, Not Incremental Research”

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Tecate Group Announces New Ultracapacitor Cells Rated forOperation up to 105°C (221°F)

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PEAK Goes Automotive Ethernet: PAE-Media Converter connects 100/1000BASE-T1 with Standard Ethernet

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Indian Firm Scales Single-Walled Carbon Nanotube Production for Batteries and Chips

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Rebellions Bets on Memory-Centric Architecture as it Weighs IPO Options

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GigaDevice Introduces GD32E512 and GD32E252 MCUs for Optical Modules

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RISC-V Targets Data Centers, Edge AI, Space

EE Times6 min read
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Logistics Leaders Navigate Cost and Automation

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Startup Ricursive to Create an End-to-End AI Model for Chip Design

EE Times6 min read
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