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China Invests Billions to Close Critical Chokepoints

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AI Startup Esperanto Winds Down Silicon Business

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NIS2 Explained: An EU Directive For Secure Networked Systems

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Wolfspeed May Emerge from Bankruptcy With CHIPS Act Help

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Codasip Faces Sale – Pivotal Moment for EU RISC-V Sovereignty

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Manufacturing Contraction Slows in June

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Electronics Supply Chains Face Crossroads Scaling AI

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How AI Is Proving Useful in New Materials Discovery for the 2nm Era

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900% Price Hike Prompts Medical Device Manufacturer to Switch ERPs

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Telink Semiconductor Launches ML7218 & ML3219 Modules: A New Choice for Smart IoT with Low-Power Innovation

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DAC 2025: Agentic AI In EDA Is Just Getting Started, And Chiplets Are All The Rage

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Quantum Sun Rises, Japan Gambit for Leadership

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A*STAR IME Launches World-First 200mm SiC Open R&D Line

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Does the Semiconductor Industry Have a Perception Problem?

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Arm: Chiplets Can’t Deliver on TCO Without an Ecosystem

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AI Clusters Spur Optical Connectivity

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Rapidus, Siemens Join 2-nm Alliance Targeting 2027 Production

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Why the Cloud Is Essential for SDV Development

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How Chip Startups Are Changing the Way Chips Are Designed

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Power your devices through universal USB-C 48 V rail, Hynetek brings new USB PD3.2 DRP Controller

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