Embedded · Scour

Ubitium's Universal Processor: A Solution to the Complexity Crisis in Embedded Systems

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HDDs Can't Compete with the Shift to SSDs in AI Infrastructure

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Orbital Data Centers: From 2.5 Gbps Links to AI-Ready Infrastructure on the ISS

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22nm RISC-V AI Chip Targets Wearables and IoT

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TPU-as-a-service, GaN Power Process, Photonic Motherboard: Embedded Week Insights

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Real-Time Motor Control with TI's New C2000 MCUs

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Grinn and MediaTek Form Strategic Partnership to Drive Next-Generation AI and IoT Solutions

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Volantis' Photonic Motherboard Promises to Slash Power in AI Datacenters

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Ambient Scientific Unveils GPX10 Pro SoC, Bringing AI-Native Performance to Battery-Powered Edge Devices

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Axiom Space and Spacebilt to Launch Optically-Interconnected Orbital Data Center Node on ISS in 2027

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Google Ponders TPU-as-a-service to Challenge Nvidia

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Innovation Update: Disruptive Innovations Often Come From Breaking Rules

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Silver Lake Secures Majority Stake in Altera, Establishing World's Largest Independent FPGA Provider

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Latent AI and Wind River Forge Strategic Alliance to Advance Edge AI for Mission-Critical Infrastructure

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Battery-Free e-Sense Tag, Electronic Thermometer, NISAR Satellite Mission: Embedded Week Insights

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WIN Semiconductors Unveils Linearity-Optimized, 0.12-µm GaN Power Process

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Cadence Expands Digital Twin Platform with NVIDIA DGX SuperPOD Model to Accelerate AI Infrastructure Development

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Beyond Silicon: Two Innovations Powering Edge AI

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Teach Old Machines New Tricks With AI Gateways

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Edge-Based In-Vehicle Conversational AI Exhibits Very Low Power

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