Computer Detection of Bent Fingers in Lead Bonding Frames (opens in new tab)

Computer Detection of Bent Fingers in Lead Bonding Frames Mitnick, Walter L. In the production of logic circuits in dual inline packages, various tedious assembly line tasks are performed by human operators using microscopes or television enlargements. One boring and difficult task is the detection of bent fingers in lead bonding frames to which integrated circuit chips are subsequently bonded. Bent fingers can cause stresses which may eventually lead to the failure of circuits. This paper di...