Meet the Intel Pioneer Behind EMIB Chip Packaging (opens in new tab)

Ravi Mahajan is a foundational figure behind Intel’s leadership in advanced packaging. As an Intel Fellow and director of Substrate and Advanced Packaging Pathfinding at Intel Foundry, he has spent more than 30 years advancing semiconductor packaging technologies.Often referred to as the inventor of EMIB (Embedded Multi-die Interconnect Bridge), Mahajan led the development of this … The post appeared first on <a href="