AMD commits more than $10bn to Taiwan’s AI ecosystem with ASE, SPIL and Helios as the visible deliverables (opens in new tab)

Covers AMD Announces More Than $10 Billion in Taiwan Ecosystem Investments to Accelerate AI Infrastructure

Lisa Su’s Taiwan announcement covers advanced silicon, packaging and manufacturing partnerships for the company’s rack-scale Helios platform, set for deployment in the second half of 2026. AMD announced on Wednesday more than $10bn of investments across Taiwan’s semiconductor ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The commitment covers a multi-year […] at The Next Web

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