Monolithic three-dimensional integration of silicon transistors (opens in new tab)  5 articles covering this post

Monolithic, three-dimensional (3D) integrated circuits promise advantages in packing density, energy consumption and interconnectivity bandwidth but require forming high-performance semiconductors and transistors on top tiers under the constraint of a limited thermal budget compatible with back-end-of-line integration1,2. Back-end-of-line-compatible transistors have been built on laser-annealed polycrystalline silicon, metal-oxide semiconductors, carbon nanotubes and two-dimensional chalcogen...