TeO2-modified SiO2-B2O3-Al2O3 glasses with enhanced dielectric constant and dissipation factor for advanced semiconductor packaging applications (opens in new tab)

Recently, glass has emerged as a core substrate material for next-generation semiconductor packaging applications compared with organic substrates because of its low dielectric property, low coefficients of thermal expansion, and excellent scalability. In this study, we present new TeO2-modified alkaline-earth alumino-borosilicate glasses with enhanced dielectric and thermomechanical properties for advanced packaging applications. The effect of TeO2 content on structural, thermomechanical, an...