Samsung Electro-Mechanics to make critical components for Qualcomm’s first AI accelerator (opens in new tab)

Samsung Electro-Mechanics, the electronic component manufacturing arm of the Samsung Group, will reportedly supply a critical component for Qualcomm's first AI accelerator. The company has started mass production of Flip-Chip Ball Grid Array (FC-BGA) substrates, which are essential for packaging high-end semiconductor chips. According to a report from ZDNet Korea, Samsung Electro-Mechanics recently began manufacturing […]