Posted by – November 20, 2025
Siemens Buildings uses this demo to explain how its liquid cooling hardware, controls and physics-based simulation tools fit together as a full-stack approach for high-density data centers running AI and HPC workloads. The in-rack cooler, sensors, valves, actuators and pump skid are all tied into a control layer that targets lower cost-to-compute and faster time-to-compute while keeping power usage effectiveness (PUE) within strict efficiency targets. More details on Siemens’ liquid-cooled data center platforms are outlined here: https://www.siemens.com/global/en/products/buildings/hvac/oem/liquid-cooling-solution-for-data-centers.html
— HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays,…
Posted by – November 20, 2025
Siemens Buildings uses this demo to explain how its liquid cooling hardware, controls and physics-based simulation tools fit together as a full-stack approach for high-density data centers running AI and HPC workloads. The in-rack cooler, sensors, valves, actuators and pump skid are all tied into a control layer that targets lower cost-to-compute and faster time-to-compute while keeping power usage effectiveness (PUE) within strict efficiency targets. More details on Siemens’ liquid-cooled data center platforms are outlined here: https://www.siemens.com/global/en/products/buildings/hvac/oem/liquid-cooling-solution-for-data-centers.html
— HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color. —
At the heart of the rack is a closed-loop liquid cooling circuit that can be connected directly to outside heat-rejection equipment without necessarily requiring a separate cooling distribution unit (CDU). The system shows how fan-wall assisted heat exchangers capture server exhaust heat, move it through a warm-water loop via variable-speed pumps, and track performance with inline flow and temperature sensing. By supporting elevated water temperatures compatible with dry coolers or high-efficiency chillers, the design allows high-density racks to run with much lower dependence on traditional air-based cooling infrastructure.
A key part of the story is Siemens’ digital twin environment, which uses CFD and thermo-fluid simulation combined with electrical and building models to predict capacity, power consumption, and PUE before ground is broken on a new facility. Operators can evaluate full-immersion, direct-to-chip, hybrid liquid–air architectures and different heat-rejection topologies, then compare layouts, operating temperatures and control strategies inside a virtual data center model. Filmed at Supercomputing 2025 (SC25) in St. Louis, this walkthrough shows how those executable digital twins shorten design cycles and de-risk large AI data center investments.
The rack on the show floor also highlights partner technologies: ZeroKelvin cold plates for direct-to-chip heat extraction, NNDC’s expertise in data center liquid cooling architectures, and Nortek Data Center Cooling equipment for in-row or CDU-based deployments. Siemens’ control stack orchestrates these components so that pumps, valves and heat exchangers operate at optimal setpoints while maintaining safe chip junction temperatures and minimizing total energy draw. That partner model lets customers mix and match hardware vendors while still using a unified controls and simulation layer for their liquid-cooled estates.
Finally, the discussion touches on sustainability and lifecycle economics: closed warm-water loops reduce or even eliminate evaporative cooling, cutting water use and enabling deployment in regions where water is scarce but land and renewable power are available. By analyzing scenarios such as “CDU vs direct loop,” “air-assisted vs full liquid,” or “heat reuse into district heating,” the Siemens toolchain helps operators trade off capex, opex, carbon intensity and grid constraints before deploying large GPU clusters. The result is a reference architecture for liquid-cooled AI data centers that seeks to balance density, efficiency, and environmental impact over the full project lifetime.
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