The presented research introduces a novel methodology for SPICE modeling, leveraging adaptive transient analysis combined with hierarchical parameter optimization to significantly enhance simulation speed and accuracy for complex, mixed-signal circuits. This approach dynamically adjusts simulation step sizes and employs a multi-level parameter tuning strategy, surpassing conventional methods in efficiency without compromising fidelity. The impact on circuit design and verification is substantial, enabling faster prototyping, reduced development costs (estimated 20-30% savings), and improved reliability characterization for next-generation integrated circuits. We detail an algorithm integrating a variable-step Runge-Kutta solver with a hierarchical Bayesian Optimization framework. Sim…

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