Longtime Slashdot reader dbialac shares a report from EL PAIS: For decades, the progress of electronics has followed a simple rule: smaller is better. Since the 1960s, each new generation of chips has packed more transistors into less space, fulfilling the famous Moore’s Law. Formulated by Intel co-founder Gordon Moore in 1965, this law predicted that the number of transistors in an integrated circuit approximately doubles each year. But this race to the minuscule is reaching its physical limits. Now, an international team of scientists is proposing a solution as obvious as it is revolutionary: if we can’t keep reducing the size of chips, let’s build them up.

Xiaohang Li, a researcher at King Abdullah University of Science and Technology (KAUST) in Saudi Arabia, and his team have designed a chip with 41 vertical layers of semiconductors and insulating materials, approximately ten times higher than any previously manufactured chip. The work, recently published in the journal Nature Electronics, not only represents a technical milestone but also opens the door to a new generation of flexible, efficient, and sustainable electronic devices. “Having six or more layers of transistors stacked vertically allows us to increase circuit density without making the devices smaller laterally,” Li explains. “With six layers, we can integrate 600% more logic functions in the same area than with a single layer, achieving higher performance and lower power consumption.”

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