Date: November 05, 2025
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America.
Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed.
With high power consistency, the M.2 2230 Key-E package and an ultra-wide operating temperature range, it meets the demands of industrial, consumer and laptop applications. In addition the module supports BLE Angle of Arrival (A…
Date: November 05, 2025
Quectel Wireless Solutions unveiled its new FME163R Wi-Fi 6 and Bluetooth 5.2 module which features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package at Embedded World, North America.
Based on the Realtek RTL8852 chipset, this low-cost module features compact dimensions of 22.0mm x 30.0mm x 2.85mm, simplifying integration in to space-constrained designed.
With high power consistency, the M.2 2230 Key-E package and an ultra-wide operating temperature range, it meets the demands of industrial, consumer and laptop applications. In addition the module supports BLE Angle of Arrival (AoA) and Angle of Departure (AoD), Bluetooth Low Energy direction-finding technologies introduced in Bluetooth 5.1 to enable precise location tracking.
Supporting both Linux and Android, capable of supporting older Android kernels (9 to 14), the high-performance module can be used for both WLAN and Bluetooth connections and support for 2 x 2 MIMO achieves a maximum physical layer data rate of 1201Mbps. The module is available with an operating temperature range of -20 °C to +70 °C, ideal for any consumer grade applications and an optional extended range of -40 °C to + 85 °C which makes it perfect for the industrial grade applications.
“The Quectel FME163R strikes the ideal balance of low power consumption and high-speed data transmission and its consistent performance and ultra-wide operating temperature range means it can meet the requirements of industrial use cases, consumer goods and laptops with ease,” said Delbert Sun, Vice General Manager and Product Head, Quectel Wireless Solutions.
“Our design effort also means that developers can lower production costs and increase production efficiency.”
The M.2 2230 Key-E form factor can also be an effective way to reduce production costs, increase production efficiency and meet the demands of complex industrial environments. In addition, the module weighs just 2.28g helping to maximize applicable use cases.
Offering support for the 2.4GHz and 5GHZ Wi-Fi bands as well as Bluetooth 5.2, the Quectel FME163R also features a reliable PCIe 1.1 interface which allows the module to deliver high-speed data transmission while achieving low power consumption. The FME163R range includes options with two or three antennas.
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