Qualcomm unveiled two data center AI accelerators, the AI200 (shipping in 2026) and AI250 (planned for 2027), marking a major pivot from its mobile and wireless roots. Both will be offered in full, liquid‑cooled server racks, matching Nvidia and AMD’s rack‑scale systems that cluster up to 72 accelerators as a single computer for training and serving advanced AI models.

Built on Qualcomm’s Hexagon NPUs originally designed for smartphones, the chips reflect a strategy to scale on‑device AI architecture to data center workloads. Shares rose 11% on the news. The new entrants intensify competition with Nvidia and AMD in the high‑growth AI data center market, where multi‑accelerator, liquid‑cooled racks are standard.

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