| Test type | Introduction |
|---|
| Electrical Performance Testing | This checks if the core electronic components (like the PCB, power supply, and main chip) are running within their designed electrical limits (voltage, current, impedance, etc.). We’re looking for any initial electrical bugs. |
| Functional Testing | This verifies that the product performs its intended functions according to your specifications. For example, if it’s an IoT sensor, we check if it can power on, connect to a network, and read/transmit data correctly. |
| Certification Pre-Scan | We perform preliminary checks for electromagnetic interference (EMI) and electromagnetic compatibility (EMC) to catch potential compliance issues early. Finding these problems now saves major headaches later! |
| Test type | Introduction |
|---|
| Reliability Testing | This is where we stress-test the product’s endurance. It includes environmental stress tests like exposure to extreme temperatures, humidity, and vibration to see how the product holds up under real-world conditions. |
| EMI/EMC Testing (Rigorous) | A comprehensive re-run of the electromagnetic tests. This ensures the product won’t interfere with other devices and is compliant with international regulatory standards (a critical step for global market access). |
| System Performance Testing | This test measures the product’s speed, efficiency, and overall performance under typical and maximum load conditions. For example, how fast does the processor run? How long does the battery last? |
| DFM/DFT Review (Design for Manufacturing/Test) | Although technically a review, it ensures the design is easy to assemble efficiently and that effective testing points are built into the production process itself. |
| Test Type | Introduction |
|---|
| Process Validation | We run a small-scale pilot production to ensure the assembly line, tooling, and manufacturing processes are stable, efficient, and consistently producing high-quality units at the required speed. |
| Final Quality Control (QC) | This involves comprehensive inspections and in-line tests during the pilot run to catch any defects introduced by the assembly process, ensuring high yield rates. |
| Packaging & Drop Testing | We test the product’s packaging design by simulating rough handling during shipping (like drop tests) to ensure the final product reaches your customers safely, without damage. |
About Author
Marketing Manager | Seeed Studio Fusion | Email: [email protected]
Seeed Studio Fusion serves as the comprehensive service platform for Seeed Studio, a global one-stop online platform for PCB manufacturing, assembly, and hardware customization. Whether you need prototyping, mass production, custom solutions for open-source products, or the transformation of your creative ideas into profitable products, Seeed Studio Fusion can meet your requirements.
http://seeedstudio.com/fusion
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