(Image credit: AMD)

Adeia has filed a pair of patent infringement lawsuits against AMD in the U.S. District Court for the Western District of Texas, claiming that AMD’s chips incorporate patented innovations covered by its hybrid bonding IP portfolio.

The company says ten patents are at issue — seven covering hybrid bonding and three tied to process nodes used in advanced logic and memory manufacturing. The litigation, announced November 3, follows what Adeia describes as years of failed licensing talks. AMD has not yet commented.

Hybrid bonding could be the foundation for the next phase of chip scaling, as performance gains shift from transistor density to vertical integration. AMD’s roadmap leans heavily on stacked designs, not just for Ryzen but for EPYC and future accelerators that layer compute, memory, and I/O. If Adeia’s claims survive early procedural challenges, the case could test how much of that stack belongs to the IP holder and how much to the foundry in any judgments that follow.

Few expect any near-term disruption to AMD’s products, since injunctions in patent cases of this kind are rarely granted under post-eBay v. MercExchange precedent. The more immediate question is whether Adeia’s claims can survive the early procedural hurdles that often decide the outcome long before trial.

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Luke James is a freelance writer and journalist. Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.