Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI (opens in new tab)

A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone who cannot reliably bring these building blocks together may still fabricate excellent transistors, but in the end all that remains is an expensive pile […]