After the release of the high-performance EPYC Embedded 9005, AMD has now introduced the EPYC Embedded 2005 Series, a mid-range processor family also based on the “Zen 5” architecture and designed for space-constrained networking, storage, and industrial edge applications.

The new SoCs feature up to 16 cores (32 threads) with 64 MB L3 cache, support dual-channel DDR5-5600 memory with ECC, and offer 28 lanes of PCIe Gen5 connectivity. It also supports advanced RAS capabilities, BMC, PCIe Hot Plug, multi-SPI ROM, and AMD Infinity Guard security. The processors come in a compact 40 x 40mm BGA package, which, according to AMD, is up to 2.4x smaller than competing enterprise solutions (Intel Xeon 6500P-B). Yet, they are designed for 24/7 operation, with up to 10 years of availability with full open-source software support. These features make it suitable for networking switches/routers, cold storage systems, aerospace, robotics, and other high-reliability embedded infrastructure.

EPYC Embedded 2005 specifications:

Feature

EPYC Embedded 2435

EPYC Embedded 2655

EPYC Embedded 2875

Architecture

Zen 5

Die Configuration

1 CCD + 1 IO

1 CCD + 1 IOD

2 CCD + 1 IOD

Cores / Threads

8C / 16T

12C / 24T

16C / 32T

Base / Boost Clock

2.8 / 4.5 GHz

2.7 / 4.5 GHz

3.0 / 4.5 GHz

L2 Cache

8 MB

12 MB

16 MB

L3 Cache

32 MB

64 MB

64 MB

Memory

2-Channel DDR5-5600 (1 DIMM/ch) or DDR5-3600 (2 DIMMs/ch) w/ sideband ECC

USB

4× USB 3.2 Gen 2 (10 Gb/s) + 1× USB 2.0 (480 Mb/s)

Expansion

28 Lanes, 11 Root Ports, SR-IOV, Enhanced Hot Plug. GPIO, I²C, I³C, SMBus, SPI, eSPI.

Security Processor

Yes

TDP

45 W

55 W

75 W

cTDP Range

45–55 W

45–75 W

45–75 W

Package

FL1 Lidless BGA: 40×40×2.133 mm, 0.81 mm pitch, 1,763 balls

Socket

1P SoC

Junction Temp

0 to 105°C

At the time of writing, the series includes only three SKUs with 45–75W configurable TDP, namely the EPYC Embedded 2435, EPYC Embedded 2655, and EPYC Embedded 2875. The company also mentions that it is manufactured using 4nm process technology for the Core Complex Die (CCD) and 6nm for the I/O Die (IOD). These chiplets are integrated into a 40x40mm BGA package, which reduces the processor’s vertical profile to just 2.13mm and allows for direct-die cooling to support fanless and ruggedized industrial deployments.

In terms of software support, the EPYC Embedded 2005 Series supports a standard embedded software stack, including EDK II firmware, Yocto-based Linux distributions, and upstream Linux kernel drivers. Other than that, there is not much additional information available at the time of writing, and AMD’s Technical Information Portal does not provide any documentation or software resources for the new series.

EPYC 2005 Chiplet Architecture

The EPYC Embedded 2005 can be considered one of a kind because it brings a full EPYC-class BGA platform for the first time in a while, now using the FL1 BGA footprint. The silicon itself is not new, as it uses the 6nm I/O die and 4nm Zen 5 chiplets from the EPYC Embedded 4005 chips. What’s truly new is that AMD is making all of its enterprise features available on an embedded chip for the first time.

At the time of writing, AMD has not disclosed pricing for the EPYC Embedded 2005 Series. The processors are currently sampling with partners, with mass production scheduled for Q1 2026. More information can be found on the company’s product page and press release.

One of the applications for AMD EPIC Embedded 2005 SoCs: industrial automation and robotics

Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication

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