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Semiconductor Engineering
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Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)
Semiconductor Engineering
13h
13 hours ago
Semiconductor Engineering
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Actions for Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)
Agentic AI Automates Design-Rule Repair While Preserving Layout Equivalence (Purdue University)
Semiconductor Engineering
13h
13 hours ago
Semiconductor Engineering
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Actions for Agentic AI Automates Design-Rule Repair While Preserving Layout Equivalence (Purdue University)
Reinforcement Learning Cuts Routing Violations in Dense Chip Layouts (NYU)
Semiconductor Engineering
14h
14 hours ago
Semiconductor Engineering
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Actions for Reinforcement Learning Cuts Routing Violations in Dense Chip Layouts (NYU)
Chiplet Co-Design Framework Reduces Energy and Design Costs for AI Accelerators (University of Michigan)
Semiconductor Engineering
14h
14 hours ago
Semiconductor Engineering
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Actions for Chiplet Co-Design Framework Reduces Energy and Design Costs for AI Accelerators (University of Michigan)
Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)
Semiconductor Engineering
14h
14 hours ago
Semiconductor Engineering
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Actions for Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)
AI in Chip Design: From Code Generation to EDA Orchestration (University of Edinburgh)
Semiconductor Engineering
15h
15 hours ago
Semiconductor Engineering
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Actions for AI in Chip Design: From Code Generation to EDA Orchestration (University of Edinburgh)
Unified Chiplet Network Scales Neuromorphic Computing Systems (Heidelberg University)
Semiconductor Engineering
15h
15 hours ago
Semiconductor Engineering
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Actions for Unified Chiplet Network Scales Neuromorphic Computing Systems (Heidelberg University)
Chip Industry Week In Review
Semiconductor Engineering
2d
2 days ago
10 min read
Semiconductor Engineering
Covers 16 stories
Mission Efficiency - Volkswagen presents the world’s most efficient near-production electric car
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Cybersecurity Alerts & Advisories
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and more ›
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Why Package Digital Twins Are So Hard To Build
Semiconductor Engineering
3d
3 days ago
10 min read
Semiconductor Engineering
Gregory Haley
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Negative Expansion Materials Resist Warpage
Semiconductor Engineering
3d
3 days ago
8 min read
Semiconductor Engineering
Bryon Moyer
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The Silicon Heartland Wants To Be America’s Next Chip Powerhouse
Semiconductor Engineering
3d
3 days ago
10 min read
Semiconductor Engineering
Brendan Heffernan
Covers 1 story
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”
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Actions for The Silicon Heartland Wants To Be America’s Next Chip Powerhouse
Beyond Scaling: The Growing Role Of Materials Innovation In Semiconductor Manufacturing
Semiconductor Engineering
3d
3 days ago
4 min read
Semiconductor Engineering
Hideaki Okamoto
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Actions for Beyond Scaling: The Growing Role Of Materials Innovation In Semiconductor Manufacturing
AI’s Storage Problem Is a Packaging Problem
Semiconductor Engineering
3d
3 days ago
4 min read
Semiconductor Engineering
Chiung Lee
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Actions for AI’s Storage Problem Is a Packaging Problem
Driving Power Delivery Innovations For The AI Data Center
Semiconductor Engineering
3d
3 days ago
1 min read
Semiconductor Engineering
Intel Foundry
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Actions for Driving Power Delivery Innovations For The AI Data Center
Virtual Fabrication Meets Stress Physics: Solving GAA Channel Non-Uniformity
Semiconductor Engineering
3d
3 days ago
5 min read
Semiconductor Engineering
Swapnil Kailash More
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Actions for Virtual Fabrication Meets Stress Physics: Solving GAA Channel Non-Uniformity
From Silicon To Systems: Heterogeneous Integration As The Engine Of AI Performance
Semiconductor Engineering
3d
3 days ago
5 min read
Semiconductor Engineering
Lalitha Immaneni
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Actions for From Silicon To Systems: Heterogeneous Integration As The Engine Of AI Performance
Predicting Silicon Behavior Years Before Test Wafers
Semiconductor Engineering
3d
3 days ago
3 min read
Semiconductor Engineering
Larry Melvin
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Actions for Predicting Silicon Behavior Years Before Test Wafers
Predictive TCAD Modeling of Normally-Off p-GaN HEMTs for Dynamic RDS(on), Leakage, Breakdown, and ML-Based Design Exploration
Semiconductor Engineering
3d
3 days ago
Semiconductor Engineering
Silvaco
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Actions for Predictive TCAD Modeling of Normally-Off p-GaN HEMTs for Dynamic RDS(on), Leakage, Breakdown, and ML-Based Design Exploration
Moving Test Data Faster
Semiconductor Engineering
4d
4 days ago
Semiconductor Engineering
Ed Sperling
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Why SoC Interconnects Have Outgrown the Bus
Semiconductor Engineering
4d
4 days ago
Semiconductor Engineering
SignatureIP
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