Semiconductor Engineering semiengineering.com

Blog Review: Feb. 25

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Purpose-Built Tools for Connected Design

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Survey of DL-Based LiDAR Super-Resolution For Autonomous Driving (University College London)

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Three New ALD/MLD Processes for Co-organic Thin Films (Aalto University, RUB et al.)

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Chip Industry Technical Paper Roundup: Feb. 24

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Research Bits: Feb. 24

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Chiplets 2026: Where Are We Today?

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Ultrafast Laser Filamentation Dictates Energy Deposition in Narrow-Gap Semiconductors

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ReRAM-based Neo-Hebbian Synapses For Training Neuromorphic HW (IIT Madras, UCSB)

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3D Atomic-Scale Metrology of Strain Relaxation And Roughness in GAAFETs Via Electron Ptychography (Cornell, ASM, TSMC)

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Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers

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New Performance Requirements For Audio

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Electrical Model of the Bitflip in SRAM Under Laser Illumination Simulating Laser Fault Injection

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Accelerator Architecture: Fusion-Aware Mapper (MIT)

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Survey of GenAI Across the Full Computing Stack, From SW To Silicon (Harvard)

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Nanoscale MoS₂-based Memristors Integrated into CMOS Microchips

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Chip Industry Week in Review

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The On-Device LLM Revolution

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Automotive Week In Review

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Redefining Backside Metallization: Low‑Temperature Solutions For HDFO And S‑SWIFT Designs

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