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Oxides Bring Low Leakage Transistors To Leading-Edge Memories

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Ripple Effects: Why Water Risk Is The Next Major Business Challenge For The Semiconductor Industry

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A Novel Side-channel Attack That Utilizes Memory Re-orderings (U. of Washington, Duke, UCSC et al.)

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Scaling of 2D Semiconductor Nanoribbons for High Performance Transistors (Purdue, NUS et al.)

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Co-optimization Approaches For Reliable and Efficient AI Acceleration (Peking University et al.)

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Non-volatile Ferroelectric Silicon Photonics As A Scalable, Heat-free Platform For Energy-efficient Photonic Computing (UPV, iPronics et al.)

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Addressing Critical Tradeoffs In NPU Design

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Blog Review: Jan. 21

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Research Bits: Jan. 20

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Chip Industry Technical Paper Roundup: Jan. 20

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Big Changes Ahead For Semiconductor Manufacturing

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Startup Funding: Q4 2025

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Low Temperature Cu-Cu Bonding for Advanced Packaging (NYCU)

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Chip Industry Week in Review

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Engineering After Orthogonalization: Why Verification Has Become A Lifecycle Discipline

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The Design Challenges Of Clock Integrity And Clock Jitter

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GDDR7 Momentum Accelerates As A Key Solution For AI Inference

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Exploring The Latest Innovations In MIPI D-PHY And MIPI C-PHY

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Smarter Write Barriers For Arm64 In .NET CoreCLR

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How And Why To Optimize NPUs

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