Semiconductor Engineering semiengineering.com

3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts

semiengineering.com·21w21 weeks ago

Actions for 3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts

SiGeSn SBFETs at Cryogenic Temperatures (Tu Wien et al)

semiengineering.com·21w21 weeks ago

Actions for SiGeSn SBFETs at Cryogenic Temperatures (Tu Wien et al)

HW-Accelerated Physical AI Framework For Resource-Constrained Edge Devices (ASU)

semiengineering.com·21w21 weeks ago

Actions for HW-Accelerated Physical AI Framework For Resource-Constrained Edge Devices (ASU)

Sparse Finite Element Problems on Neuromorphic HW (Sandia National Lab)

semiengineering.com·21w21 weeks ago

Actions for Sparse Finite Element Problems on Neuromorphic HW (Sandia National Lab)

Five Tips To Avoid Security Errors In Product Development

semiengineering.com·21w21 weeks ago

Actions for Five Tips To Avoid Security Errors In Product Development

Topology Selection For Bidirectional Energy Flow Applications Using WBG Devices

semiengineering.com·21w21 weeks ago

Actions for Topology Selection For Bidirectional Energy Flow Applications Using WBG Devices

The Evolution Of Hardware Root Of Trust Security IP

semiengineering.com·21w21 weeks ago

Actions for The Evolution Of Hardware Root Of Trust Security IP

Blog Review: Jan. 7

semiengineering.com·21w21 weeks ago

Actions for Blog Review: Jan. 7

Annual Global IC Fabs And Facilities Report

semiengineering.com·21w21 weeks ago

Actions for Annual Global IC Fabs And Facilities Report

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

semiengineering.com·22w22 weeks ago

Actions for Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

Thermal Scanning-Probe Lithography in vdW Heterostructures (TU Denmark)

semiengineering.com·22w22 weeks ago

Actions for Thermal Scanning-Probe Lithography in vdW Heterostructures (TU Denmark)

A Review Of Acoustic Side-Channel Attacks: An AI View (Penn State Univ.)

semiengineering.com·22w22 weeks ago

Actions for A Review Of Acoustic Side-Channel Attacks: An AI View (Penn State Univ.)

Research Bits: Jan. 6

semiengineering.com·22w22 weeks ago

Actions for Research Bits: Jan. 6

Chip Industry Technical Paper Roundup: Jan 6

semiengineering.com·22w22 weeks ago

Actions for Chip Industry Technical Paper Roundup: Jan 6

Cryogenic Etch: A Key Enabler Of 3D NAND

semiengineering.com·22w22 weeks ago

Actions for Cryogenic Etch: A Key Enabler Of 3D NAND

Impact Of On-Chip SRAM Size And Frequency On Energy Efficiency And Performance of LLM Inference (Uppsala Univ.)

semiengineering.com·22w22 weeks ago

Actions for Impact Of On-Chip SRAM Size And Frequency On Energy Efficiency And Performance of LLM Inference (Uppsala Univ.)

Channel-Last GAA NS Oxide FET (Stanford, TSMC, ETH Zurich et al.)

semiengineering.com·22w22 weeks ago

Actions for Channel-Last GAA NS Oxide FET (Stanford, TSMC, ETH Zurich et al.)

DL Atomistic Semi-Empirical Pseudopotential Model For Nanomaterials (UC Berkeley, LBNL et al.)

semiengineering.com·22w22 weeks ago

Actions for DL Atomistic Semi-Empirical Pseudopotential Model For Nanomaterials (UC Berkeley, LBNL et al.)

Study Of HW Acceleration for Neural Networks (Arizona State Univ.)

semiengineering.com·22w22 weeks ago

Actions for Study Of HW Acceleration for Neural Networks (Arizona State Univ.)

Exploiting Domain Wall Conduction in Nitride Ferroelectrics As A New Type of Memristive FeRAM (Kiel Univ., Fraunhofer, NaMLab, TU Dresden)

semiengineering.com·22w22 weeks ago

Actions for Exploiting Domain Wall Conduction in Nitride Ferroelectrics As A New Type of Memristive FeRAM (Kiel Univ., Fraunhofer, NaMLab, TU Dresden)

Log in to enable infinite scrolling