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Semiconductor Engineering
semiengineering.com
Scalable Fabrication of Nano-OLEDs Smaller Than The Defraction Limit (ETH Zurich, U. of Alberta, IISc)
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27w
27 weeks ago
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Research Bits: Dec. 2
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27w
27 weeks ago
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Chip Industry Technical Paper Roundup: Dec. 2
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27w
27 weeks ago
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DeepSeek’s New AI Models: V3.2 and V3.2-Speciale
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27w
27 weeks ago
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LLMs on Analog In-Memory Computing Based Hardware (IBM Research, ETH Zurich)
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27w
27 weeks ago
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3DKs: Making Headway On Chiplet Standards
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27w
27 weeks ago
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Comprehensive Performance Bound and Bottleneck Analysis Of Neuromorphic Accelerators (Harvard, Politecnico di Torino, Intel et al.)
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27w
27 weeks ago
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Chip Industry Week In Review
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28w
28 weeks ago
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Research Bits: Nov. 26
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28w
28 weeks ago
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Chip Industry Technical Paper Roundup: Nov. 26
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28w
28 weeks ago
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Blog Review: Nov. 26
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28w
28 weeks ago
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DSA Method Of 3D Interconnected Structures In Thin Films (MIT)
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28w
28 weeks ago
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Simplifying ESD Protection and Inter-Chiplet Signaling In Future 2.5D/3D Packaging Technologies (Arizona State, Univ. of Minnesota)
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28w
28 weeks ago
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Digital Memristor-Based PIM From A Device And Reliability View (Northwestern, Technion)
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28w
28 weeks ago
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Roadmap for Open-Source Chiplet-Based RISC-V Systems For HPC and AI (ETH Zurich, Univ. of Bologna)
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28w
28 weeks ago
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AI Plays Multiple Roles Within EDA
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28w
28 weeks ago
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FPGAs Find New Workloads In The High-Speed AI Era
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28w
28 weeks ago
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Shaping The Future Of AI Processors: A Tech Threads Conversation With Jim Keller
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28w
28 weeks ago
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Securing IP Integrity In Advanced SoC Design
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28w
28 weeks ago
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The Real-World Impact Of Silicon Lifecycle Management On Chip Architectures
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28w
28 weeks ago
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