EDA and IP Revenue Up 8.8%

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Loss Errors in Error-Corrected Circuits Across A Range Of Quantum Hardware Platforms (MIT, Harvard, QuEra)

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Wafer Probe Struggles To Adapt To Multi-Die Assemblies

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A Clear Advantage: Precision Glass Carrier Inspection For AI And HPC Markets

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Semiconductor Manufacturing In The AI Era

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Robust Dynamic Voltage Droop Mitigation And Power Management

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Early Zone Correction for Enhanced Overlay Precision in Next-Generation FOPLP Lithography

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Secure Data Sharing Becoming Critical For Chip Manufacturing

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Surface Metrology for Hybrid Bonding in Advanced Semiconductor Packaging

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Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms

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HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

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High-Throughput Image Sensors: Smart Testing Powers Progress

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Ultralow-Loss PIC Platform From Violet to Near-Infrared, CMOS-Foundry Compatible (Caltech, UCSB et al.)

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Doping-Dependent Charge Trapping in WS2 FETs (KU Leuven, imec, TU Wien)

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Minimizing Optical Loss While Enabling Efficient Phase Modulation in TMD-Based Devices (Nanyang Technological Univ., et al.)

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Performant Side-Channel Resistant RISC-V Core to Secure Neural Network Inference (Northeastern Univ.)

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Improving End-to-End Cyber Threat Detection with Quantum Processors Through Hybrid Architecture (Johns Hopkins Univ.)

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Chip Industry Technical Paper Roundup: Jan 12

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Data Centers Need High Reliability Semiconductors

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Research Bits: Jan. 12

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