Semiconductor Engineering semiengineering.com

Status of WBG Wide Bandgap Device Reliability in Automotive (U. Bremen et al.)

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An Exploration of Agent Scaling for HLS Design Space Exploration (IBM)

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Why Co-Packaged Optics Should be Viewed as an Architectural Commitment (UW-Madison, MIT et al.)

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CP-Based Lot Scheduling Solutions For a Semiconductor Manufacturing (Infineon, U. of Klagenfurt)

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Research Bits: Mar. 31

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Chip Industry Technical Paper Roundup: Mar. 31

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Simulations of Silicon Spin Qubits Based on a GAAFET (Teikyo U., Riken)

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Challenges In Scaling Chips To 2nm And Below

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All Software Is Hardware-Dependent

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Integrating Error Propagation Theory Into the FMEDA Framework (Robert Bosch GmbH)

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In-Depth Analysis of 187 Publications on Hardware Reverse Engineering (Ruhr U., MPI)

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Systematic Analysis of CPU-Induced Slowdowns in Multi-GPU LLM Inference (Georgia Tech)

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Chip Industry Week In Review

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AI Workloads Are Turning The Data Center Network Into A Combined Memory And Storage Fabric

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IP Requirements Evolve For 3D Multi-Die Designs

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Importance Of Hardware Security Verification In Pre-Silicon Design

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Memory Wall Gets Higher

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Precision In Depth: Extraction Workflows For CFETs And Buried Power Rails

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Shift Verification Left: AI Tools For Faster, Smarter Chip Design

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Data Boom Puts Pressure On NoCs, Fabrics

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