Junctionless Transistors Show a New Path to 3D Chips (opens in new tab)

Today’s 3-D microchips, such as the AMD MI300 series, stack prefabricated layers on top of each other and connect them with the help of metal pillars known as through-silicon vias. However, the challenge of properly aligning the connections between these layers limits how many links can be made and therefore how useful 3D stacking can be.In contrast, in monolithic 3-D chips, layers of devices are fabricated directly on top of each other. This enables alignment of these layers with nanometer-s...