💻 Chips - emschwartz · Scour

A deep dive into how ASML became a chokepoint for making cutting-edge chips by betting on EUV, close collaboration with TSMC and the US government, and more (Ne... 💎ASML

techmeme.com·3d

TSMC Hits Pause on ASML’s Newest Lithography for A13 Process 🏭TSMC

technologymagazine.com·2d·r/hardware

TSMC Aims for Sub-1-nm Test Production Starting in 2029 – The Roadmap Is Getting Smaller, the Problems Are Getting Bigger 🏭TSMC

igorslab.de·21h

Samsung’s 1.4nm chips are on track, and so is the wait 🔬Chip Fabrication

phandroid.com·14h

ASML Bibliography 💎ASML

neilhacker.com·2d·Hacker News

Chip Industry Week In Review 💎Semiconductor Trade

semiengineering.com·6d

Samsung is on track with the development of 1.4nm chips 🔗Technology Supply Chains

sammobile.com·16h

TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacki... 🏭TSMC

tomshardware.com

·1d·Hacker News

Memory Makers Are Strangling the Rest of the Tech Industry 🔗Technology Supply Chains

culpium.com·14h

Name that Ware, April 2026 🖥️Hardware Architecture

bunniestudios.com·1d

Intel is now trying to keep up with AI demand by using scrap dies 🔬Chip Fabrication

tweaktown.com·3d

The FPGA Milestone That Let Engineers Rewrite Chips Like Software 🖥️Hardware Architecture

spectrum.ieee.org

·2d·Hacker News

🍪 TWiC: TPU v8, Intel Rises Up, Marvell-Polariton 🖥GPUs

viksnewsletter.com·6d

The company with a monopoly on AI's most critical machine is racing to build more 🆕New AI

the-decoder.com

·3d

TSMC also doing quite well at the minute. www.techinasia.com ... 💎Semiconductor Trade

markjgsmith.com·5d

The Overlooked Chips Powering the AI Boom 🖥GPUs

kiplinger.com·6d

The Race to Make the World's Most In-Demand Machine (6 minute read) 🔬Chip Fabrication

Launching Straight to Mass Production: RoboSense Unveils New "EOCENE" Architecture and Dual Flagship Chips 📖E-Ink Displays

autonews.gasgoo.com·4d

TSMC's details next-gen CoWoS roadmap: over 14-reticle packages and 48x leap in compute power expected by 2029 — massive size enables 24 HBM5E stacks and additional memory bandwidth jump 🏭TSMC

tomshardware.com

·3d·Hacker News

TSMC Tech Symposium 2026, By The Numbers 🏭TSMC

semiengineering.com·3d

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