Semiconductor Engineering semiengineering.com

Security Threats Converge On IoT, Industrial ICs,

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3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts

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SiGeSn SBFETs at Cryogenic Temperatures (Tu Wien et al)

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HW-Accelerated Physical AI Framework For Resource-Constrained Edge Devices (ASU)

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Sparse Finite Element Problems on Neuromorphic HW (Sandia National Lab)

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Five Tips To Avoid Security Errors In Product Development

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Topology Selection For Bidirectional Energy Flow Applications Using WBG Devices

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The Evolution Of Hardware Root Of Trust Security IP

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Blog Review: Jan. 7

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Annual Global IC Fabs And Facilities Report

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Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

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Thermal Scanning-Probe Lithography in vdW Heterostructures (TU Denmark)

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A Review Of Acoustic Side-Channel Attacks: An AI View (Penn State Univ.)

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Research Bits: Jan. 6

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Chip Industry Technical Paper Roundup: Jan 6

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Cryogenic Etch: A Key Enabler Of 3D NAND

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Impact Of On-Chip SRAM Size And Frequency On Energy Efficiency And Performance of LLM Inference (Uppsala Univ.)

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Channel-Last GAA NS Oxide FET (Stanford, TSMC, ETH Zurich et al.)

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DL Atomistic Semi-Empirical Pseudopotential Model For Nanomaterials (UC Berkeley, LBNL et al.)

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Study Of HW Acceleration for Neural Networks (Arizona State Univ.)

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