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Semiconductor Engineering
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Does Your RISC-V Core Meet With The Standard?
Semiconductor Engineering
33w
33 weeks ago
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Building Trust At The Silicon Level: Secure Storage Solution For OTP IP
Semiconductor Engineering
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33 weeks ago
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Actions for Building Trust At The Silicon Level: Secure Storage Solution For OTP IP
Heterogeneous Multicore System IP
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33 weeks ago
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Actions for Heterogeneous Multicore System IP
Multi-Die Assemblies Require More Detailed Test Plan Earlier
Semiconductor Engineering
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33 weeks ago
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Actions for Multi-Die Assemblies Require More Detailed Test Plan Earlier
AI’s Impact On Engineering Jobs May Be Different Than Initial Projections
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33 weeks ago
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Actions for AI’s Impact On Engineering Jobs May Be Different Than Initial Projections
Autonomous Driving: Motion Planner Executed on Automotive-Grade Embedded HW (TU Munich)
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33 weeks ago
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Actions for Autonomous Driving: Motion Planner Executed on Automotive-Grade Embedded HW (TU Munich)
Ultra-low-bit LLM Inference Allows AI-PC CPUs And Discrete Client GPUs To Approach High-end GPU-Level (Intel)
Semiconductor Engineering
34w
34 weeks ago
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Actions for Ultra-low-bit LLM Inference Allows AI-PC CPUs And Discrete Client GPUs To Approach High-end GPU-Level (Intel)
Agentic AI In Chip Manufacturing
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34w
34 weeks ago
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Actions for Agentic AI In Chip Manufacturing
The Next-Generation of Circuit Simulation in RF EDA
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34w
34 weeks ago
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Actions for The Next-Generation of Circuit Simulation in RF EDA
Blog Review: Jan. 28
Semiconductor Engineering
34w
34 weeks ago
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Actions for Blog Review: Jan. 28
New Innovative Way to Functionally Verify Heterogeneous 2D/3D Package Connectivity
Semiconductor Engineering
34w
34 weeks ago
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Actions for New Innovative Way to Functionally Verify Heterogeneous 2D/3D Package Connectivity
Will It Blend: A Methodology for Verifying the Hardware/Software Interface in Complex SoCs
Semiconductor Engineering
34w
34 weeks ago
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Actions for Will It Blend: A Methodology for Verifying the Hardware/Software Interface in Complex SoCs
Automated High-Speed Interface Routing in Multi-Die Designs
Semiconductor Engineering
34w
34 weeks ago
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Actions for Automated High-Speed Interface Routing in Multi-Die Designs
Voice is the New UI
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34w
34 weeks ago
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Actions for Voice is the New UI
Engineering Challenges Grow With Crystalline Defects
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34w
34 weeks ago
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Actions for Engineering Challenges Grow With Crystalline Defects
Research Bits: Jan. 27
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34 weeks ago
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Actions for Research Bits: Jan. 27
Chip Industry Technical Paper Roundup: Jan. 27
Semiconductor Engineering
34w
34 weeks ago
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Actions for Chip Industry Technical Paper Roundup: Jan. 27
Semiconductor Supply Chain Security Using Side-Channel Power Measurements and Generative Adversarial Networks (Cornell)
Semiconductor Engineering
34w
34 weeks ago
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Actions for Semiconductor Supply Chain Security Using Side-Channel Power Measurements and Generative Adversarial Networks (Cornell)
MFMIS FeTFETs For Energy-Efficient, Scalable CIM Hardware Accelerators (Seoul National University)
Semiconductor Engineering
34w
34 weeks ago
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Actions for MFMIS FeTFETs For Energy-Efficient, Scalable CIM Hardware Accelerators (Seoul National University)
Software-Defined Systems
Semiconductor Engineering
34w
34 weeks ago
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Actions for Software-Defined Systems
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