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Semiconductor Engineering
semiengineering.com
Six-Stack Vertically Integrated Hybrid Platform For Large Area Electronics (KAUST, Imperial College Et Al.)
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33w
33 weeks ago
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Thermal Simulation And Optimization in 3D-IC Design (Intel, UCSB, Cadence)
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33w
33 weeks ago
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Multiple Challenges Emerge With Physical AI System Design
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33w
33 weeks ago
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Blog Review: Oct. 22
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33w
33 weeks ago
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Photonics as a Carbon-Sustainable Solution for Next-Gen AI Hardware (Boston Univ., NY CREATES, Lightmatter, Cornell Tech)
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33w
33 weeks ago
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Implementing Power Dynamic Response For Greener AI Data Centers (Univ. of Cambridge, Nyobolt, Nanyang Tech)
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33w
33 weeks ago
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Modulation of the Inner Gate Length in MFMIS NSFETs To Achieve Big Gains in Memory Window (Samsung, Seoul National Univ.)
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33w
33 weeks ago
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Chip Industry Technical Paper Roundup: Oct. 21
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33w
33 weeks ago
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Research Bits: Oct. 21
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33w
33 weeks ago
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Understanding and Mitigating Column-Based Read Disturbance in DRAM Chips (ETH Zurich, CISPA)
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33w
33 weeks ago
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Microarchitectural Defense Strategy Against EM Side-Channel Attacks (Northeastern Univ., Binghamton Univ.)
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33w
33 weeks ago
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In-System Test For AI Data Centers
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33w
33 weeks ago
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AI Bubble Or Boom?
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33w
33 weeks ago
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3D Stacked HBM and Accelerators for LLMs: Heat Management and PDN (Georgia Tech, SK Hynix)
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34w
34 weeks ago
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Beyond BPD: Backside Clock and Signal Routing for Sub-3nm (UT Austin, Intel)
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34w
34 weeks ago
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Statistical Model Checking As An Evaluation Tool of Microarchitectural Side Channels (Duke, Harvard, Univ. of Florida)
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34w
34 weeks ago
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Chip Industry Week in Review
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34w
34 weeks ago
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Gallium-Based SMP for High-Performance Cu-to-Cu Bonding (National Cheng Kung Univ.)
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34w
34 weeks ago
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Advanced Packaging: A Key Technology For The Next Generation Of Electronics
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34w
34 weeks ago
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Integrated Modular Firmware Solutions: A Vital Component Of Custom Silicon Chiplet Architecture Designs
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34w
34 weeks ago
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