Workload-Driven HBF Substrate For Capacity-Scalable LLM Inference (Huawei, ETH Zurich, HUST)

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Trust, But Verify

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Photonics Forces A Chiplet Rethink

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Hybrid HBM-HBF Architecture in LLM Inference (University of Oxford)

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M3D 6T SRAM With BEOL Pass-Gates at 2nm (Georgia Tech, Synopsys)

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Intrinsic Polarization Superjunctions Boost GaN-On-Silicon Power Devices (EPFL)

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Cycle-Level Simulator for Distributed GPUs For AI Workloads (Purdue)

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Molecular Dynamics Study Explains Aluminum Dopant Activation In 4H-SiC (TU Wien, Silvaco)

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Programmable Silicon Photonics Filter Enables Continuous Laser Wavelength Tuning (UiT, Stanford)

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Predicting Post-Route PPA from Macro and Standard-Cell Placements (U. of Alberta)

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Rowhammer Backdoor Injection Attack During Inference (Northeastern)

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Open-Source Benchmark Suite For 2.5D/3D Heterogeneous Integration Research in Physical Design (UCLA)

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Ferroelectric Tuning Reduces Optical-Interconnect Stalls In LLM Training (Georgia Tech)

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Generative Design Optimizes Liquid-Cooling Channels For 2.5D And 3D Packages (UM-Dearborn)

Semiconductor Engineering
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Sapphire Surface Modification Enables Wafer-Scale 2D Semiconductor Growth (Peking U., CAS et al.)

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Deep Learning Automates Parameter Extraction For 2D Transistors (Stanford, SLAC)

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Hot Chips AI HW wave; HBM vs HBC; capacity buildout; Infineon’s latest buy; advanced packaging enablers; foundry report; ASIC security threats; IC tariffs; executive changes;...

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Issues Stack Up With More HBM Layers

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From Spec To Formal Properties

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Agentic AI Success Relies On Excellent Human Scaffolding

Semiconductor Engineering10 min read
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